Publié il y a 2 mois
Data Center Infrastructure Engineer
@ Xanadu
Toronto, Ontario
En bref
Xanadu is hiring a Data Center Infrastructure Engineer for its Hardware Team in Toronto to design rack-scale infrastructure and sub-system mechanical packaging for its photonic quantum computers. The work covers thermal and hydraulic sizing, CFD/FEA simulation, GD&T and mechanical design. The role is full-time, a new position, with a base salary of 140,000 to 180,000+ CAD plus equity and benefits.
Responsabilités :
- Model and size rack infrastructure: CDUs, PDUs, liquid manifolds, fiber managers
- Own mechanical design of sub-system modules integrating into racks
- Perform thermal and hydraulic sizing and CFD/FEA simulation
- Define GD&T and tolerance stack-ups for blind-mate connections
- Collaborate with photonic, electrical, optical and software teams
Résumé des exigences :
- BSc or higher in mechanical engineering or related field
- 5+ years in data center thermal/mechanical systems
- Hands-on thermal simulation (CFD/FEA) experience
- Proficiency in GD&T (ASME Y14.5) and tolerance analysis
- Deep knowledge of mechanical packaging and fluid fittings
- Preferred: MSc, 8+ years experience, rack-scale and OCP/EIA-310 work
Outils et compétences
Avantages mentionnés
Source et dates
Type de source non vérifié · hibob
- Date publiée par l’employeur
- 2026-09-16
- Première détection par notre source
- 2026-10-27
- Mise à jour du dossier source
- 2026-10-27
Ces dates décrivent le dossier source, pas une vérification en direct du recrutement. Consultez l’offre originale.
Détails du poste
| Niveau | Senior |
| Domaine | Génie |
| Expérience | 5 an(s) et plus |
| Heures par semaine | 40 (estimé) |
| Milieu de travail | Laboratoire, Bureau |
| Position | Assis et debout |
| Exigences physiques | physique faible · ordinateur élevé |
| Langues | English |
| Formation | Baccalauréat (exigé), Maîtrise (préféré) |
| Domaines d’études | Mechanical engineering |
| Avantages mentionnés | Actions ou participation |
Résumé et détails rédigés par l’IA à partir de l’offre; l’offre de l’employeur fait foi.
Xanadu
Profil d’entreprise sauvegardé
Renseignements historiques provenant d’un profil The Jobs API sauvegardé (champs LinkedIn/Crunchbase). Ils ne sont pas vérifiés en temps réel; les chiffres peuvent avoir changé. Les valeurs manquantes restent inconnues.
Description complète de l’entreprise
Xanadu Quantum Technologies Inc. is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers. Founded in 2016, Xanadu's mission is to build quantum computers that are useful and available to people everywhere. To achieve this mission, the company has taken a full-stack approach and builds hardware, software, and pursues state-of-the-art research with select partners. The company is also advancing the field of quantum machine learning (QML) through the development of PennyLane, an open-source project that has become a leading software library among quantum researchers and developers. Xanadu is bringing together exceptional minds from around the world to build something extraordinary. Learn more at xanadu.ai
- Abonnés LinkedIn
- 56 801
- Personnes associées sur LinkedIn
- 342
- Bureaux déclarés
- Toronto, Ontario M5B 2H7, CA
- Autres noms enregistrés
- Xanadu
- Spécialités
- Quantum Computing
- Artificial Intelligence
- Machine Learning
- Deep Learning
- Cloud Computing
- Quantum Simulations
- and Quantum Algorithms
- Le profil indique une agence de recrutement
- Non
Xanadu Quantum Technologies Inc. is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers. Founded in 2016, Xanadu's mission is to build quantum computers that are useful and available to people everywhere. To achieve this mission, the company has taken a full-stack approach and builds hardware, software, and pursues state-of-the-art research with select partners…
| Champ | Valeur |
|---|---|
| Secteur | Computer Hardware Manufacturing |
| Taille | 51-200 employees |
| Siège social | Toronto, Ontario |
| Type d’organisation | Privately Held |
| Fondée en | 2016 |
| Spécialités | Quantum ComputingArtificial IntelligenceMachine LearningDeep LearningCloud ComputingQuantum Simulationsand Quantum Algorithms |
| Offres sur Jobsy | 79 |
| Voir la page |
Xanadu’s mission is to build quantum computers that are useful and available to people everywhere.
At Xanadu, we are learners, innovators, researchers, collaborators and problem solvers. We are creating something that has never been built before. Few people in their life will be able to be a part of something like this, where if we are successful, the technologies we develop will solve some of the world’s most challenging problems, and literally change the world. And that is something to be excited about!
Your role and responsibilities:
As part of the Hardware Team in Toronto, you will take your experience in delivering complex mechanical, vibration-control, and thermal-cooling solutions and apply it to Xanadu’s rack-scale quantum computer development. In this role, you will bridge facility-level infrastructure design with chassis-level mechanical packaging. You will model and size key rack infrastructure (CDUs, PDUs, liquid manifolds, fiber managers) while owning the mechanical design of the sub-system modules that integrate directly into our racks. With your strong background in mechanical design, thermal/liquid management, and complex assemblies, you will take mechanical ownership of the world's first photonic quantum computers deployed at scale.
Basic qualifications and experience:
- BSc or higher in mechanical engineering or a relevant, related discipline.
- 5+ years of industry experience in data center thermal/mechanical systems engineering.
- Proficiency in system-level thermal and hydraulic sizing, including selecting and integrating Cooling Distribution Units (CDUs), Power Distribution Units (PDUs), manifolds, and liquid cooling loops.
- Hands-on experience with thermal simulations (CFD/FEA) to achieve precise temperature stability, uniform heat distribution, and low vibration across both sub-system enclosures and rack-level environments.
- Proficiency in GD&T (ASME Y14.5) and tolerance stack-up analysis for complex assemblies, particularly for blind-mate power and fluid connections.
- Deep familiarity with mechanical packaging (sheet metal design, machined components, structural frames, and quick-disconnect fluid fittings).
- Self-motivated and adaptable, comfortable working both independently and collaboratively with cross-functional teams (photonic, electrical, optical, and software engineers) in a fast-paced environment.
- Strong interpersonal and technical communication skills, with a track record of taking end-to-end mechanical ownership of complex hardware deliverables.
- MSc in mechanical engineering or a relevant, related discipline.
- 8+ years of combined academic and industry experience, including 3+ years leading mechanical packaging or data center infrastructure projects in a commercial industry environment.
- End-to-end experience specifying, sizing, or designing rack-scale infrastructure, including liquid-to-liquid / liquid-to-air Cooling Distribution Units (CDUs), secondary fluid loops, manifolds, and high-density Intelligent PDUs.
- Proven track record in sub-system module packaging, designing complex mechanical assemblies (50+ unique parts) integrating sensitive electronics, high-power compute/optical ICs, or photonic components.
- Hands-on experience with customized rack frameworks compliant with EIA-310, OCP (Open Compute Project), or custom high-density cabinet standards, including structural load analysis and blind-mate mechanical guide systems.
- Advanced thermal and hydraulic modeling expertise, using CAD mesh definitions and CFD tools (e.g., Ansys Icepak, SimScale, FloTHERM) to simulate both chip-level cold plate temperatures and macro-level fluid pressure drops across full rack manifolds.
- Expertise in passive and active vibration mitigation, including structural and acoustic vibration isolation within chassis and interconnect assemblies to protect phase-sensitive optical/photonic paths from pump, fan, or fluid dynamics.
- Expert-level experience with major CAD and CAM software.
- Hands-on experience with industry manufacturing techniques for metallic and plastic parts.
- Hands-on experience with CNC machining and 3D printing to quickly prototype concepts and ideas.
- Experience liaising with machining centers for parts production.
- Experience working in multidisciplinary teams to extract requirements.
- Experience with high-volume sheet metal stamping and forming processes, with a strong understanding of DFM principles.
- An exceptional candidate will have experience specifying or designing production rack-scale electrical power distribution.
Our values are important. They are fundamental and lay the foundation for culture at Xanadu. Learn more about our values here.
We are an equal opportunity employer and encourage candidates of all backgrounds to apply. We are committed to building an inclusive, safe, and equitable culture and fostering an environment where our employees feel included, valued, and heard. We are committed to meeting the needs of all individuals and support a barrier-free workplace. Should you require accommodations at any point during the recruitment process please contact Recruiting at [email protected].
Please be advised that we may use artificial intelligence (AI) tools to assist in the screening and assessment of applicants for this position. These tools assist our recruitment team but do not replace human judgment. Final hiring decisions are ultimately made by humans. If you would like more information about how your data is processed, please contact us.
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