Publié il y a 2 mois
Engineer - 6G RF Packaging
@ Huawei Technologies Canada Co., Ltd.
Ottawa, Ontario
En bref
Huawei Technologies Canada is hiring an Engineer for a 12-month contract in its Ottawa Advanced Wireless Technology Wireless Lab, focused on 6G RF packaging. The work covers 2.5D/3D integration, low-loss interconnects, EM simulation and RF measurement of package performance. The target annual compensation is $104,000 to $154,000 depending on education and experience.
Responsabilités :
- Research 2.5D/3D integration and wafer-level packaging
- Develop low-loss die-to-package interconnects and shielding
- Perform full-wave EM simulations of interconnect loss and coupling
- Coordinate VNA, thermal and OTA array measurements
- Secure patents and publish technical papers
Résumé des exigences :
- Five years of relevant industry experience
- PhD in electrical engineering, RF/microwave or packaging preferred
- Deep knowledge of RF/microwave principles
- Experience with full-wave EM and circuit simulation tools
- Hands-on test vehicle and microelectronics assembly experience
Outils et compétences
Source et dates
Site carrière / système de candidatures · recruitee
- Date publiée par l’employeur
- 2026-09-11
- Première détection par notre source
- 2026-10-10
- Mise à jour du dossier source
- 2026-11-09
Ces dates décrivent le dossier source, pas une vérification en direct du recrutement. Consultez l’offre originale.
Détails du poste
| Niveau | Senior |
| Domaine | Génie |
| Expérience | 5 an(s) et plus |
| Heures par semaine | 40 (estimé) |
| Milieu de travail | Laboratoire, Bureau |
| Position | Assis et debout |
| Exigences physiques | physique faible · ordinateur élevé |
| Langues | English |
| Formation | Doctorat (préféré) |
| Domaines d’études | Electrical Engineering, RF/Microwave Engineering, Packaging |
Résumé et détails rédigés par l’IA à partir de l’offre; l’offre de l’employeur fait foi.
Huawei Technologies Canada Co., Ltd.
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| Champ | Valeur |
|---|---|
| Secteur | Telecommunications |
| Taille | 10001+ |
| Siège social | Shenzhen, Guangdong |
| Offres sur Jobsy | 187 |
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Huawei Canada has an immediate 12-month contract opening for an Engineer.
About the team:
Welcome to the Advanced Wireless Technology Wireless Lab, an epitome of innovation located in Ottawa, Canada. Here, amid the dynamic panorama of technological progress, our team consists mainly of seasoned graduate computer engineers and computer scientists. With diverse experiences ranging from fresh perspectives to decades-long industry immersion, we are united by our fervour for pioneering wireless solutions.
About the job:
Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
Secure patents and invention disclosures while publishing papers and internal technical reports.
The total target annual compensation for this position ranges from $104,000 to $154,000 depending on education, experience, and demonstrated expertise.
About the ideal candidate:
5 years of relevant industry experiences.
PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
Deep knowledge of RF/microwave principles.
Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.
Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).
Proficiency with RF lab equipment (VNAs), probe station.
Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.
Additional Information:
Huawei Canada is committed to a fair, inclusive, and accessible recruitment process. If you require accommodation during any stage of the hiring process, please let us know and we will work with you to meet your needs.
All applications for this position are reviewed directly by our hiring team, we do not use artificial intelligence tools to screen or select candidates.
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