Sr. Engineer, Mechanical Design

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Join Tenstorrent as a Mechanical Design Engineer and own the mechanical and thermal design of high-performance AI computing hardware, from high-power PCIe cards and multi-chip server systems to complete systems that turn our AI accelerators into shippable products. You will carry products from first concept through full-scale production, engineering for manufacturability and assembly from day one so hardware comes off the line right the first time. This is a short-loop environment: what you design gets built, tested, and improved on real hardware within days, and you will be at the bench when it does. If watching your work go from CAD model to shipping product quickly is what drives you, you will fit right in.

This role ishybrid, based out of Toronto, Canada.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• You have a Bachelor’s or Master’s degree in Mechanical Engineering or equivalent, with 3+ years of hands-on mechanical design experience, ideally in high-performance electronics.
• You are proficient in CAD tools such as SolidWorks or Creo and experienced in electronics enclosure design, including integration with thermal management solutions.
• You understand manufacturing processes such as injection molding, die-casting, extrusion, stamping, and 3D printing, and apply design-for-manufacturing and assembly principles from the start.
• You are skilled in GD&T and engineering drawing creation, and comfortable building, testing, and reworking designs hands-on in a lab.
• You take ownership, adapt when priorities shift, and can travel internationally up to 10% for supplier visits and critical design reviews.

What We Need

• Design and validate mechanical and thermal solutions for high-power AI hardware, including PCIe cards, multi-chip server systems, fixtures, and tooling.
• Engineer for manufacturability and assembly from the first concept, partnering with suppliers to optimize cost, quality, and lead time.
• Run FEA to assess mechanical reliability, including PCB microstrain validation, and use data to guide design decisions.
• Collaborate with PCB, thermal, and electrical teams to integrate board layouts, enclosures, and cooling systems; contribute hands-on to vibration, shock, thermal cycling, and environmental testing.
• Manage BOMs and part lifecycles in a PLM system, and create engineering drawings, test reports, and design guidelines that support product development.

What You Will Learn

• How mechanical design shapes advanced AI computing platforms built around Tenstorrent silicon.
• How new silicon and systems move from first power-on through production.
• How to turn AI accelerators into complete, shippable products—from PCIe cards to full systems.
• How to work across silicon, thermal, electrical, and software engineering, as well as with suppliers and test labs around the world.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

This offer of employment is contingent upon the applicant being eligible to access U.S. export-controlled technology. Due to U.S. export laws, including those codified in the U.S. Export Administration Regulations (EAR), the Company is required to ensure compliance with these laws when transferring technology to nationals of certain countries (such as EAR Country Groups D:1, E1, and E2). These requirements apply to persons located in the U.S. and all countries outside the U.S. As the position offered will have direct and/or indirect access to information, systems, or technologies subject to these laws, the offer may be contingent upon your citizenship/permanent residency status or ability to obtain prior license approval from the U.S. Commerce Department or applicable federal agency. If employment is not possible due to U.S. export laws, any offer of employment will be rescinded.