Postuler

Publié il y a 11 mois

Advanced Packaging Design Engineer

@ AttoTude

Ottawa, Ontario

Postuler
SIGNAUX

En bref

AttoTude is hiring an Advanced Packaging Design Engineer in Ottawa, ON, for a full-time, on-site role. The work covers advanced packaging architecture, detailed design, validation and new product introduction, with cross-functional and supplier collaboration.

Responsabilités :

  • Design advanced packaging solutions
  • Conduct research and development initiatives
  • Collaborate with cross-functional teams and suppliers
  • Manage deliverables for timely delivery
  • Own architecture through new product introduction

Résumé des exigences :

  • Experience in advanced silicon packaging and multichip module design
  • Mechanical, thermal and FEA modeling experience
  • Proven product development from concept to volume production
  • Ability to drive cross-disciplinary technical collaboration
  • Master's degree or higher in Mechanical Engineering, Materials Science or related field

Outils et compétences

Source et dates

Site carrière / système de candidatures · greenhouse

Date publiée par l’employeur
2025-12-17
Première détection par notre source
2026-10-08
Mise à jour du dossier source
2026-10-10

Ces dates décrivent le dossier source, pas une vérification en direct du recrutement. Consultez l’offre originale.

Détails du poste

DomaineGénie
Heures par semaine40 (estimé)
Milieu de travailBureau, Laboratoire
PositionSurtout assis
Exigences physiquesphysique faible · ordinateur élevé
LanguesEnglish
FormationMaîtrise (exigé)
Domaines d’étudesMechanical Engineering, Materials Science

Résumé et détails rédigés par l’IA à partir de l’offre; l’offre de l’employeur fait foi.

AttoTude

Profil d’entreprise sauvegardé

Renseignements historiques provenant d’un profil The Jobs API sauvegardé (champs LinkedIn/Crunchbase). Ils ne sont pas vérifiés en temps réel; les chiffres peuvent avoir changé. Les valeurs manquantes restent inconnues.

A leap forward in networking.

Description complète de l’entreprise

The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI. AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing applications.

Abonnés LinkedIn
1 058
Personnes associées sur LinkedIn
41
Bureaux déclarés
  • Menlo Park, CA 94025, US
  • Ottawa, Ontario, CA
  • San Diego, CA, US
  • Dallas, TX, US
Catégories d’activité
  • Information Technology
  • Internet
  • Artificial Intelligence (AI)
  • Wireless
Autres noms enregistrés
  • AttoTude
Le profil indique une agence de recrutement
Non
Investissement total déclaré
142 000 000

La devise et la date d’observation ne sont pas fournies; ce n’est ni une valorisation actuelle ni une ronde de financement.

The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI. AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing…

ChampValeur
SecteurTechnology, Information and Internet
Taille11-50 employees
Siège socialMenlo Park, CA
Type d’organisationPrivately Held
Fondée en2024
Offres sur Jobsy1
LinkedInVoir la page
Description

Role Description

This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.

Qualifications

  • Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.

    Mechanical, thermal and FEA modeling and design experience.

  • Proven track-record of product development, from concept through volume production.

  • Ability to work effectively in cross-disciplinary teams and drive technical collaborations.

  • Excellent analytical and problem-solving skills.
  • Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.

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