Publié il y a 11 mois
Advanced Packaging Design Engineer
@ AttoTude
Ottawa, Ontario
En bref
AttoTude is hiring an Advanced Packaging Design Engineer in Ottawa, ON, for a full-time, on-site role. The work covers advanced packaging architecture, detailed design, validation and new product introduction, with cross-functional and supplier collaboration.
Responsabilités :
- Design advanced packaging solutions
- Conduct research and development initiatives
- Collaborate with cross-functional teams and suppliers
- Manage deliverables for timely delivery
- Own architecture through new product introduction
Résumé des exigences :
- Experience in advanced silicon packaging and multichip module design
- Mechanical, thermal and FEA modeling experience
- Proven product development from concept to volume production
- Ability to drive cross-disciplinary technical collaboration
- Master's degree or higher in Mechanical Engineering, Materials Science or related field
Outils et compétences
Source et dates
Site carrière / système de candidatures · greenhouse
- Date publiée par l’employeur
- 2025-12-17
- Première détection par notre source
- 2026-10-08
- Mise à jour du dossier source
- 2026-10-10
Ces dates décrivent le dossier source, pas une vérification en direct du recrutement. Consultez l’offre originale.
Détails du poste
| Domaine | Génie |
| Heures par semaine | 40 (estimé) |
| Milieu de travail | Bureau, Laboratoire |
| Position | Surtout assis |
| Exigences physiques | physique faible · ordinateur élevé |
| Langues | English |
| Formation | Maîtrise (exigé) |
| Domaines d’études | Mechanical Engineering, Materials Science |
Résumé et détails rédigés par l’IA à partir de l’offre; l’offre de l’employeur fait foi.
AttoTude
Profil d’entreprise sauvegardé
Renseignements historiques provenant d’un profil The Jobs API sauvegardé (champs LinkedIn/Crunchbase). Ils ne sont pas vérifiés en temps réel; les chiffres peuvent avoir changé. Les valeurs manquantes restent inconnues.
A leap forward in networking.
Description complète de l’entreprise
The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI. AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing applications.
- Abonnés LinkedIn
- 1 058
- Personnes associées sur LinkedIn
- 41
- Bureaux déclarés
- Menlo Park, CA 94025, US
- Ottawa, Ontario, CA
- San Diego, CA, US
- Dallas, TX, US
- Catégories d’activité
- Information Technology
- Internet
- Artificial Intelligence (AI)
- Wireless
- Autres noms enregistrés
- AttoTude
- Le profil indique une agence de recrutement
- Non
- Investissement total déclaré
- 142 000 000
La devise et la date d’observation ne sont pas fournies; ce n’est ni une valorisation actuelle ni une ronde de financement.
The landscape of data centers is rapidly changing to accommodate the explosive growth of artificial intelligence. However, current networking technologies are a bottleneck, inhibiting the full potential of AI. AttoTude's innovative approach to interconnect technology is designed to remove these barriers, allowing data centers to fully support the demands of high-speed parallel processing and supercomputing…
| Champ | Valeur |
|---|---|
| Secteur | Technology, Information and Internet |
| Taille | 11-50 employees |
| Siège social | Menlo Park, CA |
| Type d’organisation | Privately Held |
| Fondée en | 2024 |
| Offres sur Jobsy | 1 |
| Voir la page |
Role Description
This is a full-time, on-site role located in Ottawa, ON, for an Advanced Packaging Engineer. The responsibilities include designing advanced packaging solutions, conducting research and development initiatives, collaborating with cross-functional teams and suppliers, and managing deliverables to ensure timely delivery. The role requires hands-on problem-solving and the ability to innovate in a rapidly evolving technical environment. Responsibilities range from architecture, detailed design, validation and new product introduction.
Qualifications
Experience in advanced silicon packaging, multichip module and high-speed interposer designs as well as solid understanding of assembly process.
Mechanical, thermal and FEA modeling and design experience.
Proven track-record of product development, from concept through volume production.
Ability to work effectively in cross-disciplinary teams and drive technical collaborations.
- Excellent analytical and problem-solving skills.
- Master’s degree or higher in Mechanical Engineering, Materials Science, or related field.
Journal
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