Publié il y a 3 mois
Principal Advanced Optical Packaging Engineer
@ Ranovus
Ottawa, Ontario
En bref
Ranovus is hiring a Principal Advanced Optical Packaging Engineer in Ottawa, Ontario, for a full-time role. The engineer develops and industrializes packaging for optical engines used in AI and data-center connectivity, from process architecture through NPI and manufacturing transfer.
Responsabilités :
- Translate product requirements into packaging and assembly strategies
- Develop flip-chip, die attach and BGA assembly processes
- Lead hybrid laser and fiber attach process development
- Drive NPI, qualification and production transfer
- Manage suppliers, CMs and OSAT partners
Résumé des exigences :
- 10+ years in advanced optical or semiconductor packaging
- Hands-on flip-chip and fine-pitch die attach experience
- Experience with fiber-array and optical alignment
- Practical knowledge of soldering, underfill and adhesives
- Bachelor's in engineering, physics or optics required
Outils et compétences
Avantages mentionnés
Source et dates
Site carrière / système de candidatures · bamboohr
- Date publiée par l’employeur
- 2026-08-23
- Première détection par notre source
- 2026-10-08
- Mise à jour du dossier source
- 2026-10-09
Ces dates décrivent le dossier source, pas une vérification en direct du recrutement. Consultez l’offre originale.
Détails du poste
| Niveau | Chef d’équipe |
| Domaine | Génie |
| Expérience | 10 an(s) et plus |
| Heures par semaine | 40 (estimé) |
| Milieu de travail | Laboratoire, Usine |
| Position | Assis et debout |
| Exigences physiques | physique faible · ordinateur modéré |
| Langues | English |
| Formation | Baccalauréat (exigé), Maîtrise (préféré), Doctorat (préféré) |
| Domaines d’études | Mechanical Engineering, Materials Engineering, Electrical Engineering, Physics, Optics |
Résumé et détails rédigés par l’IA à partir de l’offre; l’offre de l’employeur fait foi.
Ranovus
Profil d’entreprise sauvegardé
Renseignements historiques provenant d’un profil The Jobs API sauvegardé (champs LinkedIn/Crunchbase). Ils ne sont pas vérifiés en temps réel; les chiffres peuvent avoir changé. Les valeurs manquantes restent inconnues.
Lighting up the Future of AI®
Description complète de l’entreprise
The world-class team of scientist and engineers at Ranovus is comprised of professionals with a unique combination of decades of expertise in product development of optoelectronics components and transceiver subsystems for the information technology industry. Ranovus' disruptive innovation in Quantum Dot Multi-Wavelength Laser combined with advanced digital and photonics integrated circuit technologies is setting a new industry benchmark for the next generation of optical interconnect solutions. Our technology delivers significant reduction in power dissipation, size and cost of interconnects, and enables a much higher degree of distortion tolerance compared to traditional solutions, thereby enabling a "freeway" architecture to reduce network latency.
- Abonnés LinkedIn
- 5 447
- Personnes associées sur LinkedIn
- 119
- Bureaux déclarés
- 11 Hines Rd, 101, Ottawa, Ontario K2K 2X1, CA
- Catégories d’activité
- Information Technology
- Data Center
- Optical Communication
- Telecommunications
- Computer
- Autres noms enregistrés
- Ranovus
- RANOVUS Inc.
- Spécialités
- Inter/Intra Data Center Connectivity
- Digital and Photonics Integrated Circuit Technologies
- Optical Transmission
- Advanced Packaging Technologies
- and Co-Packaged Optics
- Le profil indique une agence de recrutement
- Non
- Investissement total déclaré
- 99 819 077
La devise et la date d’observation ne sont pas fournies; ce n’est ni une valorisation actuelle ni une ronde de financement.
The world-class team of scientist and engineers at Ranovus is comprised of professionals with a unique combination of decades of expertise in product development of optoelectronics components and transceiver subsystems for the information technology industry. Ranovus' disruptive innovation in Quantum Dot Multi-Wavelength Laser combined with advanced digital and photonics integrated circuit technologies is setting…
| Champ | Valeur |
|---|---|
| Secteur | Telecommunications |
| Taille | 51-200 employees |
| Siège social | Ottawa, Ontario |
| Type d’organisation | Privately Held |
| Fondée en | 2012 |
| Spécialités | Inter/Intra Data Center ConnectivityDigital and Photonics Integrated Circuit TechnologiesOptical TransmissionAdvanced Packaging Technologiesand Co-Packaged Optics |
| Offres sur Jobsy | 18 |
| Voir la page |
Principal Advanced Optical Packaging Engineer
Location: Ottawa, Ontario | Type: Full-time
The Opportunity
Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This hands-on role covers package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, thermal-mechanical risk management, burn-in, tooling, automation, and manufacturing transfer. Working directly with design teams, equipment developers, suppliers, CMs, and OSAT partners.
What You Will Own
- Package & Process Architecture: Translate product requirements into packaging/assembly strategies; define build sequences, inspection points, rework, and test gates; lead DFM/DFA/DFT/DFR reviews; identify risks and drive DOEs/qualification.
- Flip-Chip, Die Attach & Electrical Integration: Develop/qualify flip-chip and fine-pitch die-attach processes (copper-pillar, BGA, LGA, WLCSP); define reflow, solder paste, flux, and cleaning approaches; manage warpage, CTE mismatch, and voiding; develop underfill/encapsulation processes; define AOI, X-ray, and cross-section inspection methods.
- Laser Packaging & Hybrid Integration: Lead hybrid laser-to-carrier and laser-to-ePIC assembly process development; work with laser die, lenses, isolators, and couplers; define alignment, attachment, and burn-in/test flows; manage supplier specs for laser components.
- Fiber Attach & Optical I/O: Develop repeatable fiber-array attach processes (single-mode, PM fiber, multi-fiber arrays); define alignment strategy, adhesive/cure processes, and loss-control methods; support automated fiber-attach station development (motion, vision, dispensation, calibration).
- Thermal-Mechanical & Materials: Evaluate thermal paths and manage package stress/warpage/CTE mismatch; select and qualify solders, underfills, adhesives, TIMs, and encapsulants; partner with mechanical/simulation specialists.
- NPI & Manufacturing Transfer: Lead processes from POC through NPI, qualification, and production ramp; define tooling, SOPs, PFMEAs, and control plans; drive root-cause/corrective action; decide what stays in-house vs. transfers to partners
- Required Experience
- 10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.
- Demonstrated ownership of packaging processes from development through NPI/production transfer.
- Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.
- Strong grasp of how optical, mechanical, thermal, electrical, material, and manufacturing requirements interact in an optoelectronic package.
- Practical knowledge of soldering, wetting, flux, intermetallics, surface finishes, underfill, adhesives, curing, and contamination control.
- Experience with DOEs, process characterization, qualification builds, and failure analysis.
- Experience defining process windows, inspection criteria, and manufacturing controls.
- Ability to distinguish lab demonstrations from robust, transferable manufacturing processes.
- Experience with external manufacturing partners, equipment suppliers, or component vendors.
- Strong technical judgment and communication skills.
Particularly Valuable Experience
- Laser/laser-array/hybrid laser-photonic subassembly packaging; co-packaged or external laser sources.
- Single-mode edge coupling, lensed coupling, mode-field conversion, isolators, turning optics.
- Laser characterization, chip-on-carrier test, burn-in, reliability qualification.
- Silicon photonics packaging for transceivers/optical engines (800G–6.4T+).
- Automated optical alignment equipment (e.g., FiconTEC); motion control, machine vision, force sensing, UV curing.
- Organic substrates, advanced interposers, high-density BGA connectors.
- Thermal-mechanical modeling (warpage, stress, CTE, solder-joint reliability).
- SPC, MSA, GR&R, Cp/Cpk, yield improvement.
- CAD experience (SolidWorks or comparable).
Education
Bachelor's in Mechanical, Materials, Electrical Engineering, Physics, Optics, Photonics, Packaging Engineering, or related field required; Master's/PhD preferred. Deep relevant experience may substitute for an advanced degree.
The Successful Candidate
Someone who has personally built and debugged complex optoelectronic hardware who is able to explain not just what process was used, but why, what the failure mechanisms were, and how it was transferred to manufacturing. Comfortable moving between architecture-level and hands-on assembly discussions, and capable of bringing the right specialists together to reach engineering decisions.
Journal
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