Technical Fellow, Advanced Packaging Integration
Ottawa, ONTemps plein
T
TechInsights
10+ ansCandidates need 10+ years of semiconductor packaging, interconnect or processor design experience and a Master's or PhD in a related field. They must be deeply familiar with advanced packaging processes, processor and chiplet architecture, or system power and thermal analysis, and be able to travel up to 25%.
AI-enabled analysis tools
Circuit Delayering Specialist
Ottawa, ONTemps plein
T
TechInsights
Candidates need a bachelor's degree in electrical engineering, nanotechnology, materials science or a related field. Hands-on lab sample preparation and SEM experience are needed, along with knowledge of semiconductor processing and WHMIS, and willingness to work early morning or evening shifts.
SEM, optical microscope, x-ray equipment