3D IC and ADVANCED PACKAGING CAD ENGINEER
Markham, ONAdvanced Micro Devices, Inc
Candidates need a bachelor's or master's degree in computer or electrical engineering, experience with 3D-IC design and advanced packaging, and hands-on work with Synopsys 3DIC Compiler. Strong scripting skills and experience applying AI to CAD or hardware design are also needed.
Synopsys 3DIC Compiler, Synopsys EDA tools, Cadence EDA tools, Linux/Unix, Python, TCL
SoC Physical Design Implementation Lead
Markham, ONAdvanced Micro Devices, Inc
Advanced Micro Devices needs seasoned physical design experience on advanced nodes, with hands-on place and route, timing and sign-off skills. Candidates should know Synopsys, Cadence and Siemens tools and scripting in Tcl, Perl or Shell; a Bachelor's or Master's in electrical or computer engineering is preferred.
Synopsys tools, Cadence tools