Technical Fellow, Advanced Packaging Integration
Ottawa, ONTemps plein
T
TechInsights
10+ ansCandidates need 10+ years of semiconductor packaging, interconnect or processor design experience and a Master's or PhD in a related field. They must be deeply familiar with advanced packaging processes, processor and chiplet architecture, or system power and thermal analysis, and be able to travel up to 25%.
AI-enabled analysis tools
Advanced Packaging Analyst
Ottawa, ONTemps plein
T
TechInsights
5+ ansCandidates need a relevant degree, 5+ years of foundry or OSAT experience in advanced packaging processes, and experience interpreting SEM, TEM, EDS, EELS and FIB results. Strong analytical, written and oral communication skills are also required.
SEM, TEM, EDS, EELS, FIB