Principal Advanced Optical Packaging Engineer
Ottawa, ONHybrideTemps plein
R
Ranovus
10+ ansCandidates need 10+ years in optical, photonic, optoelectronic or semiconductor packaging, with hands-on experience in flip-chip, die attach, laser and fiber alignment. A bachelor's degree in an engineering, physics or optics field is required, and a master's or PhD is preferred.
SolidWorks