Microelectronic Packaging Design Engineer
Ottawa, ONGlobal Talent Alliance, Canada
5+ ansCandidates need a bachelor's degree in mechanical engineering, physics or a related field, plus at least 5 years of electronic hardware and semiconductor packaging experience. Experience with wafer level and chip scale packaging, CAD and FEA tools is needed, and a security clearance is an asset.
AutoCAD, SolidWorks, Cadence Allegro Package Designer Plus, FEA software
Senior Microelectronic Design Engineer
Ottawa, ONGlobal Talent Alliance, Canada
8+ ansCandidates need a relevant bachelor's degree, at least 8 years of industry experience in electronic hardware and semiconductor packaging, and skill with CAD, FEA and packaging design software. Strong communication skills and the ability to work in a fast-paced multidisciplinary team are required.
AutoCAD, SolidWorks, Cadence Allegro Package Designer Plus, FEA tools