Packaging Engineer - Die Bonding Process
Toronto, ONXanadu: is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers.
2+ ansCandidates need a BSc or higher in engineering or science and 2+ years in a lab or cleanroom. They need basic semiconductor packaging knowledge, epoxy and flip-chip die bonding experience, and microscopy skills.
Die bonding equipment, Microscope, Die shear test equipment
Sr. Packaging NPI Engineer
Toronto, ONXanadu: is a Canadian quantum technology company, and one of the world's leading photonic quantum hardware providers.
5+ ansCandidates need a master's degree in a technical field, 5+ years of packaging engineering experience focused on new product introduction, and proven work with packaging technologies. Knowledge of photonic on-chip and off-chip systems and CAD and statistical tools is also required.
SolidWorks, AutoCAD, FiconTEC equipment