Sr. Manager Packaging Engineering
Markham, ONTemps plein
AI
AMD, Inc.
Candidates need a bachelor's degree or higher in electrical, computer, or mechanical engineering, plus experience leading teams on complex semiconductor package projects. Strong program management, stakeholder communication, and familiarity with high-speed design and advanced packaging are needed.
Synopsys 3DICC, Cadence SiP, Cadence APD
Design Verification Engineer
Markham, ONTemps plein
AI
AMD, Inc.
AMD asks for advanced ASIC functional verification experience and hands-on work on multiple projects or tapeouts. Candidates need Verilog, SystemVerilog, UVM, scripting skills, and a Bachelor's or Master's in Computer or Electrical Engineering.
Verilog, UVM, Makefiles, Perl, Python, Ruby