Technical Fellow, Advanced Packaging Integration
Ottawa, ONTechInsights
10+ ansCandidates need 10+ years of semiconductor packaging, interconnect or processor design experience and a Master's or PhD in a related field. They must be deeply familiar with advanced packaging processes, processor and chiplet architecture, or system power and thermal analysis, and be able to travel up to 25%.
AI-enabled analysis tools
Semiconductor Process Analyst
Ottawa, ONTechInsights
Candidates need semiconductor industry experience or equivalent academic experience, plus knowledge of advanced CMOS, memory, image sensor or III-V manufacturing. Strong analytical, communication and presentation skills are required.
SEM, TEM, EDS, EELS, SIMS, FTIR
Circuit Analyst
Ottawa, ONTechInsights
5+ ansCandidates need a BSc in Electrical Engineering, preferably in microelectronics, and 5+ years of relevant industry experience. Strong CMOS or FinFET circuit design and physical layout knowledge are required, plus experience with memory, RF or processor technologies.
proprietary CAD tool